Contracted Assembly

Modern technology and highly specialized production lines allow us to provide comprehensive automated SMD surface mount and through-hole wave solder assembly services.

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Electronic Component Assembly

Our modern technology park and highly specialized production lines allow us to provide comprehensive automated SMD surface-mount assembly and through-hole wave solder assembly services. We maintain a stock of production materials with full inventory of commissioned components, guaranteeing safety and proper storage in accordance with applicable standards.

Design

We provide full engineering services, including device and system concept development, design, software development, and the preparation of manufacturing documentation. Our design team’s work results in products that meet design specifications and optimize production costs.

SMT Assembly

SiMS offers a full range of SMT assembly services:

  • Single-sided and double-sided SMD component assembly using reflow soldering technology;
  • manual assembly of through-hole components and wave soldering;
  • supplementary assembly of through-hole and mechanical components;
  • mixed assembly; and automatic optical inspection of assembled boards.

Depending on the customer’s requirements and needs, assembly can be performed using in-house or customer-supplied components. Our range of services is further expanded to include:

  • PCB design; design of solder paste and glue stencils; assembly of components,
  • including printed circuit board protection and solder paste or glue application stencils according to provided documentation;
  • testing of assembled systems in accordance with the client’s guidelines.

Our SMD assembly line

JUKI FX-3 (Super High Speed ​​Chipshooter) – assembly machine

The FX-3 is a high-performance chip shooter equipped with four heads, each with six suction cups. The machine’s throughput, measured according to the IPC 9850 standard, is 60,000 components per hour. The machine is equipped with a laser centering system that positions components “on the fly” between the feeder and the plate.

  • PCB dimensions min. 50x50mm, max. 410×360 mm max.;
  • component height on the BOTTOM side 40 mm;
  • 4 heads, each picking up 6 components simultaneously (a total of 24 components can be picked up simultaneously);
  • capacity 60,000 components per hour; component size from 0201 (0.4×0.2 mm) to 33.5×33.5 mm;
  • accuracy +/- 50 um;
  • maximum number of 8mm feeders – 120 pcs.

JUKI KE-2060R

This SMD assembly line boasts a throughput of 12,500 pcs/hour. The line is based on the JUKI KE-2060R, which utilizes laser and vision positioning. This allows us to place components ranging in size from 0.6×0.3mm (0201) to 150x50mm with an accuracy of +/- 0.05mm using laser positioning and +/- 0.03mm using vision positioning. The minimum lead pitch for assembled components is 0.2mm, and the minimum ball pitch for BGA systems is 0.25mm. The maximum board size is 510x360mm.

ERSA POWERFLOW (Wave soldering system)

ERSA POWERFLOW is a modern, high-performance wave soldering system designed for the assembly of THT and mixed-mode components. The machine ensures a stable and repeatable soldering process thanks to precise control of parameters such as temperature, contact time, and solder flow. The system is equipped with a fluxing, preheating, and wave soldering zones, ensuring high-quality solder joints and the reliability of finished electronic assemblies. ERSA POWERFLOW is ideal for mass production, meeting the high quality requirements of modern assembly lines.

HOTFLOW 2/12

We have a reflow soldering oven – HOTFLOW 2/12. This is a state-of-the-art device designed for lead-free soldering. Its long heating zone (3500mm) with a controlled temperature profile allows for soldering small-pitch integrated circuits, including µBGAs.

Ekra X4

The Ekra X4 is a state-of-the-art, automatic screen printer. It is equipped with an automatic optical plate centering system, a side-mounted plate feed module, and programmable feed speed and squeegee pressure. The device features a vertical plate-stencil separation function, which allows for maintaining high print precision requirements: reliability and repeatability, especially with small screens. The device is controlled via a PC and can only be operated by a trained operator.